A selective encapsulation solution for packaging an optical micro electro mechanical system

by Bowman, Amy Catherine.

Abstract (Summary)

Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).

Bibliographical Information:

Advisor:

School:Worcester Polytechnic Institute

School Location:USA - Massachusetts

Source Type:Master's Thesis

Keywords:microelectromechanical systems electronic packaging electrolytic corrosion semiconductor switches

ISBN:

Date of Publication: