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A selective encapsulation solution for packaging an optical micro electro mechanical system

by Bowman, Amy Catherine.

Abstract (Summary)
Keywords: packaging; micro electro mechanical systems; MEMS; electronics; die warpage; die bow; encapsulant; encapsulate; electrochemical migration; corrosion; wirebonds. Includes bibliographical references (p. 94-99).
Bibliographical Information:

Advisor:

School:Worcester Polytechnic Institute

School Location:USA - Massachusetts

Source Type:Master's Thesis

Keywords:microelectromechanical systems electronic packaging electrolytic corrosion semiconductor switches

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