Warpage Study of TFBGA Packaging

by Wang, Chih-Hao

Abstract (Summary)
The current packaging trend toward to smaller and thinner has pushed the manufacturing technology to the limits. During the assembly processes of IC packages, delamination at interfaces and mechanical breakage of components are common mode of failure. The induced thermal stress within the package is one of the major contributions to these failures. According to the disparity of the coefficient of thermal expansion (CTE) between different components, internal thermal stress and warpage will be induced when the package undergoes temperature excursion. In this paper, the Die attach epoxy curing and encapsulation curing process induced warpage and thermal stress were studied by finite element software Marc & Mentat. As comparison, two kinds of Molding materials of the package considered, and the result will compared with the experimental data. Finally, studied the effect of the material thickness and the impact significance of each design variable on the design objective will also be discussed.
Bibliographical Information:

Advisor:Wen-Tung Chien; Ming-Hwa Jen; Shi-Pin Ho; Shyue-Jian Wu

School:National Sun Yat-Sen University

School Location:China - Taiwan

Source Type:Master's Thesis

Keywords:thermal stress finite element method warpage


Date of Publication:06/20/2001

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