Abstract (Summary)
In this research, design and processing of multi-stack three-dimensional RF coil has been investigated and developed to meet the needs of small-size high-resistance inductors. Different materials and fabrication technologies have been developed to build a three-dimensional coil structure in the most stable and efficient method. The experimented sample was built on the surface of a standard 2-inch wafer. The height of the poles is limited by the aspect ratios of the photoresist and polyimide used in the fabrication process. Both AZ4620 photoresist and PI2611 polyimide film techniques have been tried to improve the structure to the limit. An initial mask was designed to test the limitation of equipment and materials. A final mask with more conservative design has been fabricated and showed better results. In order to correctly evaluate the efficiency of the experimented sample, a simple model has been developed to estimate the magnetic fields generated by the coil. More precise results were obtained HFSS® software. The final samples were measured with a Vector Network Analyzer to provide two port S-Parameters. Inductance value was manually calculated and also simulated with Agilent ADS. Some suggestions have also been made in the final chapter about how to further improve the processing of the three-dimensional coil.
Bibliographical Information:


School:University of Cincinnati

School Location:USA - Ohio

Source Type:Master's Thesis

Keywords:microwave engineering mems coil inductor mmic 3 d


Date of Publication:01/01/2003

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