Synthesis and characterization of sol-gel derived PI/silica hybrid material for low dielectric constant application

by Hu, Yu-cheng

Abstract (Summary)
Sol-gel process was utilized to produce organic/inorganic composite in this research, and the effect of mixing time¡]of polymer¡¦s and silica¡¦s precursor¡^ and coupling agent were investigated. To get low ? materials was also the important objective. TMA, TGA, SEM, FT-IR, and RF impedance were used to investigate thermal properties, chemical bonding, morphology, and dielectric constant, respectively. The experiments showed that mixing time influence little to thermal stability but a lot to morphology and ?. When mixing time was nearer to reaction time, the particle of silica was larger and the surface was flatter. The materials with coupling agent didn¡¦t show the same tendency as one without coupling agent. Regardless of coupling agent, it got larger ? when mixing time was nearer to reaction time. Comparing with pure polymer, the modified materials got lower ?. The lowest ? got in this research was 2.36 which was lower than other materials.
Bibliographical Information:

Advisor:Tzu-chien Hsu; Hong-yang Lu; Bing-hwait Hwang

School:National Sun Yat-Sen University

School Location:China - Taiwan

Source Type:Master's Thesis

Keywords:gptms pi teos 6fda oda ipts hybrid material dielectric constant


Date of Publication:07/24/2004

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