The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process

by Chang, Chih-Fang

Abstract (Summary)
The main aim of this study is to extending the holographic interferometry technique to measure the effect of the temperature ramp-up rate on the warpage of IC packages in the IR-reflow process . It is noted that both the warpage and the ambient temperature change can cause image fringes. Therefore, an auxiliary sphere is used to identify the fringe numbers caused by the ambient temperature change during the experiment. Then, the Taguchi method will be deduced to study the effect of the temperature ramp-up rate and peak waiting temperature on the warpage of PBGA package in the IR-reflow process.
Bibliographical Information:

Advisor:Ting-Nung Shiau; Chi-Hui Chien; Yi-Tai Ciu

School:National Sun Yat-Sen University

School Location:China - Taiwan

Source Type:Master's Thesis

Keywords:warpage fringe order ic package holographic interferometry


Date of Publication:09/06/2000

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