The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process

by Hung, Chien-Hsiung

Abstract¡G The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moisture and temperature status are chosen for the purpose of study. The result shows that the moisture and temperature change do yielding the change of the warpage of the IC package.