The Study of the Moisture Effect on the Interfacial adhesion of IC Packages in the IR-Reflow Process

by Weng, Da-Jiun

Abstract¡G This study imitated the IC package with different solder mask thickness in different environment of the temperature and moisture to see if the adhesion strength changed after IR-Reflow process. The temperature and moisture of the environment were decided base on the possible conditions that the IC package might encounter in the real situation. After the temperature and moisture in the environment worked interactively and reciprocally, we found that the thickness of solder mask indeed cause the change of adhesion strength. The thickness of solder mask affected by the raising of the temperature and moisture caused the apparent reduction of the interface adhesion strength due to the softening of the material and the penetrating of the moisture. Besides, the specimen fracture surface occurred between solder mask and FR-4 substrate under any experimental conditions and progress confirmed that the measured strength is the adhesion strength between solder mask and FR-4.