Design and analysis of planar and multilevel inductors

by Phillips, Michael D.

Abstract (Summary)
Industry today is pushing personal portable handheld communication de- vices, from cellular telephones to personal navigation systems, and society is embracing the push. The goal is to make compact multi-functional handheld products that can transfer information to those around us through high bandwidth mobile communications. These modules rely heavily on radio frequency (RF) and microwave components, which play a critical role in the realization of the transceiver, an essential building block in any handheld. High performance active and passive RF components can lead to more efficient modules that facilitate integration of multiple communication protocols with attractive features within a single handheld. With light weight and compactness being the emphasis in the design of these modules, compact design of RF components is currently considered to be a part of the design criteria. An RF inductor is one of the widely used performance limiting components that has applications in every wireless system. Large footprint, moderate inductance values and low quality factors have often made these devices unsuitable for on-chip implementation. Many of the existing RF inductor designs seldom take advantage of multilayer structures or integration of magnetic materials to achieve improved electrical performance and compact footprint. This research explores the design and development of compact RF inductors in planar and multilevel configurations to meet some of the goals listed above. Design techniques and analysis of several new structures in microstrip and stripline configurations are presented. These include two planar inductors, viz., clover and hairpin and two multilevel toroidal inductors with and without the intermediate ground plane. Compact footprint with improved electrical performance is the primary focus in proposing these designs. Also proposed in this research is the investigation of ferrite enhancement techniques for improving the electrical performance of planar and multi-layered structures with compact footprint. Several inductor configurations are designed and their performance is compared with the conventional inductor geometries in terms of inductance, quality factor and the overall figure of merit. Full-wave electromagnetic simulations are carried out for all designs and the theoretical results for selected inductor configurations are also validated by measurement. This research on the development of new, compact inductor topologies can lead to the realization of high-performance RF front-ends for application to a wide range of wireless communication systems.
Bibliographical Information:

Advisor:Settaluri, Raghu K.

School:Oregon State University

School Location:USA - Oregon

Source Type:Master's Thesis

Keywords:electric inductors design and construction


Date of Publication:05/26/2005

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